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Q²M Compound+ REDEFINED is engineered for aggressive defect removal where standard compounds are not sufficient. It targets deep scratches, sanding marks, and severe paint defects with high efficiency.
The formulation is designed to maintain strong cutting power while keeping the working process controlled and predictable during machine polishing.
This compound combines heavy abrasion with refined finishing behavior. In some cases, light holograms may appear, but they are easily removed with a single finishing polish step.
This makes it suitable for structured correction workflows where speed and consistent results are required.
Despite its cutting strength, the product is formulated for low dust generation and easy residue removal. It contains no fillers or silicones, ensuring real correction rather than masking defects.
After use, the paint surface is fully corrected and ready for refining polish or coating application depending on the required finish level.
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